Intel® Turbo Boost TechnologyIntel® Turbo Boost Technology dynamically increases the processor's frequency as needed by taking advantage of thermal and power headroom to give you a burst of speed when you need it, and increased energy efficiency when you don’t.
Intel® vPro™ Platform EligibilityIntel® vPro™ Technology is a set of security and manageability capabilities built into the processor aimed at addressing four critical areas of IT security: 1) Threat management, including protection from rootkits, viruses, and malware 2) Identity and web site access point protection 3) Confidential personal and business data protection 4) Remote and local monitoring, remediation, and repair of PCs and workstations.
Intel® Virtualization Technology (VT-x)Intel® Virtualization Technology (VT-x) allows one hardware platform to function as multiple “virtual” platforms. It offers improved manageability by limiting downtime and maintaining productivity by isolating computing activities into separate partitions.
Intel® Virtualization Technology for Directed I/O (VT-d)Intel® Virtualization Technology for Directed I/O (VT-d) continues from the existing support for IA-32 (VT-x) and Itanium® processor (VT-i) virtualization adding new support for I/O-device virtualization. Intel VT-d can help end users improve security and reliability of the systems and also improve performance of I/O devices in virtualized environments.
Intel® VT-x with Extended Page Tables (EPT)Intel® VT-x with Extended Page Tables (EPT), also known as Second Level Address Translation (SLAT), provides acceleration for memory intensive virtualized applications. Extended Page Tables in Intel® Virtualization Technology platforms reduces the memory and power overhead costs and increases battery life through hardware optimization of page table management.
Intel® 64Intel® 64 architecture delivers 64-bit computing on server, workstation, desktop and mobile platforms when combined with supporting software.¹ Intel 64 architecture improves performance by allowing systems to address more than 4 GB of both virtual and physical memory.
Instruction SetAn instruction set refers to the basic set of commands and instructions that a microprocessor understands and can carry out. The value shown represents which Intel’s instruction set this processor is compatible with.
Instruction Set ExtensionsInstruction Set Extensions are additional instructions which can increase performance when the same operations are performed on multiple data objects. These can include SSE (Streaming SIMD Extensions) and AVX (Advanced Vector Extensions).
Idle StatesIdle States (C-states) are used to save power when the processor is idle. C0 is the operational state, meaning that the CPU is doing useful work. C1 is the first idle state, C2 the second, and so on, where more power saving actions are taken for numerically higher C-states.
Enhanced Intel SpeedStep® TechnologyEnhanced Intel SpeedStep® Technology is an advanced means of enabling high performance while meeting the power-conservation needs of mobile systems. Conventional Intel SpeedStep® Technology switches both voltage and frequency in tandem between high and low levels in response to processor load. Enhanced Intel SpeedStep® Technology builds upon that architecture using design strategies such as Separation between Voltage and Frequency Changes, and Clock Partitioning and Recovery.
Thermal Monitoring TechnologiesThermal Monitoring Technologies protect the processor package and the system from thermal failure through several thermal management features. An on-die Digital Thermal Sensor (DTS) detects the core's temperature, and the thermal management features reduce package power consumption and thereby temperature when required in order to remain within normal operating limits.
Intel® Demand Based SwitchingIntel® Demand Based Switching is a power-management technology in which the applied voltage and clock speed of a microprocessor are kept at the minimum necessary levels until more processing power is required. This technology was introduced as Intel SpeedStep® Technology in the server marketplace.
Spécifications
Caractéristiques
| Bit de verrouillage | Oui |
| Configuration CPU (max) | 2 |
| Configurations de PCI Express | 1x16/1x4/1x8 |
| États Idle | Oui |
| Évolutivité | 2S |
| Extension d'adresse physique (PAE) | Oui |
| Extension d'adresse physique (PAE) | 46 bit |
| Les options intégrées disponibles | Non |
| Nombre maximum de voies PCI Express | 40 |
| Segment de marché | Server |
| Set d'instructions pris en charge | AVX |
| Technologies de surveillance thermique | Oui |
| Version des emplacements PCI Express | 3.0 |
Caractéristiques spéciales du processeur
| Accès mémoire Intel® Flex | Non |
| Clé de sécurité Intel® | Oui |
| Demande Intel® Based Switching | Oui |
| Intel® 64 | Oui |
| Intel® Garde SE | Oui |
| Intel® vPro™ Platform Eligibility | Oui |
| Intel® VT-x avec Extended Page Tables (EPT) | Oui |
| Nouvelles instructions Intel® AES (Intel® AES-NI) | Oui |
| Technologie de vitalisation d'Intel® (VT-x) | Oui |
| Technologie Intel® Hyper Threading (Intel® HT Technology) | Non |
| Technologie Intel® Identity Protection (Intel® IPT) | Non |
| Technologie Intel® Turbo Boost | No |
| Technologie Intel® Virtualization Technology pour les E/S dirigées (VT-d) | Oui |
| Technologie SpeedStep évoluée d'Intel | Oui |
| Technologie Trusted Execution d'Intel® | Oui |
Conditions environnementales
Graphique
| Adaptateur de carte graphique distinct | Non |
| Carte graphique intégrée | Non |
| Modèle d'adaptateur graphique distinct | Indisponible |
| Modèle d'adaptateur graphique inclus | Indisponible |
Mémoire
| Canaux de mémoire | Quad-channel |
| ECC | Oui |
| Mémoire interne maximum prise en charge par le processeur | 768 Go |
| Types de mémoires pris en charge par le processeur | DDR3-SDRAM |
| Vitesses d'horloge de mémoire prises en charge par le processeur | 1066/1333/800 MHz |
Poids et dimensions
| Taille de l'emballage du processeur | 52.5 x 45 mm |
Processeur
| Bus informatique | 6,4 GT/s |
| composant pour | Serveur/Station de travail |
| Enveloppe thermique (TDP, Thermal Design Power) | 80 W |
| Famille de processeur | Famille Intel® Xeon® E5 V2 |
| Fréquence de base du processeur | 1,8 GHz |
| Fréquence du processeur | 1,8 GHz |
| ID ARK du processeur | 76157 |
| Largeur de bande de mémoire prise en charge par le processeur (max) | 42,6 Go/s |
| Lithographie du processeur | 22 nm |
| Mémoire cache du processeur | 10 Mo |
| Modèle de processeur | E5-2603V2 |
| Modes de fonctionnement du processeur | 64-bit |
| Nom de code du processeur | Ivy Bridge EP |
| Nombre de coeurs de processeurs | 4 |
| Nombre de threads du processeur | 4 |
| Socket de processeur (réceptable de processeur) | LGA 2011 (Socket R) |
Vendor information
| Brand Name | Hewlett Packard Enterprise |
| Warranty | 1 |