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TS256GMTE662P
  • TS256GMTE662P

TS256GMTE662P

Transcend
256GB, M.2 2280, 3D NAND, PCIe 3.1 x2, NVMe 1.3, S.M.A.R.T, ECC, 3.3V, 22x80x3.88mm, 9g
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Quantity
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Description
Transcend's MTE662P M.2 SSD features the PCI Express (PCIe) Gen 3 x4 interface and is compatible with NVM Express (NVMe) 1.3 specifications to achieve never-before-seen transfer speeds. The MTE662P features state-of-the-art 3D NAND technology, which allows 96 layers of 3D NAND flash chips to be vertically stacked. Compared to 3D NAND at 64 layers, this density breakthrough greatly improves storage efficiency, and its built-in DRAM cache allows faster access. Applied with 30µ" gold finger PCB and Corner Bond technology, the MTE662P is fully tested in-house, boasting an endurance rating of 3K Program/Erase cycles and an extended operating temperature ranging from -20°C~75°C. The built-in Power Loss Protection (PLP) further ensures data integrity in mission-critical applications.

Transcend also offers the MTE662P-I with wide temperature (-40℃ ~ 85℃) capabilities to ensure sustained functionality, enhanced endurance, and optimal reliability in mission-critical applications.
  • Supports NVM command
  • SLC caching technology
  • Dynamic thermal throttling
  • Built-in LDPC ECC (Error Correction Code) functionality
  • Advanced Global Wear-Leveling and Block management for reliability
  • Advanced Garbage Collection
  • Supports S.M.A.R.T. function to conduct health monitoring, analysis, and reporting for storage devices
  • Full drive encryption with Advanced Encryption Standard (AES) (optional)
  • Compliant with RoHS 2.0 standards
  • Compliant with NVM Express specification 1.3
  • Compliant with PCI Express specification 3.1
  • Space-saving M.2 form factor (80mm) – ideal for mobile computing devices
  • PCIe Gen 3 x4 interface
  • DDR4 DRAM Cache embedded
  • Endurance: 3K P/E cycles (Program/Erase cycles) guaranteed
  • Key components fortified by default with Corner Bond technology
  • 30µ" PCB gold finger
  • Power Loss Protection (PLP) to prevent data loss in the event of sudden power outage
  • Extended Temp. (-20°C ~ 75°C) and Wide Temp. (-40°C ~ 85°C) options available
  • Supports Transcend Scope Pro software

Specifications

Features

Component forPC/Laptop
Data retention3 year(s)
Drive writes per day (DWPD)2
ECCYes
InterfacePCI Express 3.1
M.2 key IDM
M.2 SSD size2280 (22 x 80 mm)
Mean time between failures (MTBF)3000000 h
Memory type3D NAND
NVMeYes
NVMe version1.3
PCI Express CEM revision3.1
PCI Express interface data lanesx4
Random read (4KB)340000 IOPS
Random write (4KB)355000 IOPS
S.M.A.R.T. supportYes
Sequential read speed (CDM)3400 MB/s
Sequential write speed (CDM)2300 MB/s
SSD capacity256 GB
SSD form factorM.2
TBW rating2200

Operational conditions

Operating relative humidity (H-H)5 - 95 %
Operating shock15 G
Operating temperature (T-T)-20 - 75 °C
Operating vibration20 G
Storage temperature (T-T)-40 - 85 °C

Other features

Compliance certificatesBSMI/CE/Federal Communications Commission (FCC)/UKCA

Power

Operating voltage3.3 V
Power consumption (average)3.4 W
Power consumption (idle)0.9 W

Vendor information

Brand NameTranscend
Warranty1
Product Details
2026-07-13
New

Data sheet

NVMe
Yes
ECC
Yes
TBW rating
2200
M.2 key ID
M
Stromverbrauch (Leerlauf)
0.9 W
Mean time between failures (MTBF)
3000000 h
Compliance certificates
BSMI/CE/Federal Communications Commission (FCC)/UKCA
Speichertyp
3D NAND
SSD-Formfaktor
M.2
SSD-Kapazität
256 GB
SMART-Unterstützung
Yes
Zufälliges Lesen (4KB)
340000 IOPS
Zufälliges Schreiben (4 KB)
355000 IOPS
Betriebsspannung
3.3 V
Betriebsvibration
20 G
Betriebsschock
15 G
NVMe-Version
1.3
Stromverbrauch (Durchschnitt)
3.4 W
Schnittstelle
PCI Express 3.1
Brand Name
Transcend
Warranty
1
Komponente für
PC/Laptop
Betriebstemperatur (TT)
-20 - 75 °C
Lagertemperatur (TT)
-40 - 85 °C
Relative Luftfeuchtigkeit im Betrieb (HH)
5 - 95 %
Drive writes per day (DWPD)
2
Sequentielle Lesegeschwindigkeit (CDM)
3400 MB/s
Sequentielle Schreibgeschwindigkeit (CDM)
2300 MB/s
M.2 SSD size
2280 (22 x 80 mm)
Datenspuren der PCI-Express-Schnittstelle
x4
Vorratsdatenspeicherung
3 Jahr(e)
PCI Express CEM-Revision
3.1

Specific References

MPN
TS256GMTE662P
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