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TS256GMTE662P
256GB, M.2 2280, 3D NAND, PCIe 3.1 x2, NVMe 1.3, S.M.A.R.T, ECC, 3.3V, 22x80x3.88mm, 9g
Description
Transcend's MTE662P M.2 SSD features the PCI Express (PCIe) Gen 3 x4 interface and is compatible with NVM Express (NVMe) 1.3 specifications to achieve never-before-seen transfer speeds. The MTE662P features state-of-the-art 3D NAND technology, which allows 96 layers of 3D NAND flash chips to be vertically stacked. Compared to 3D NAND at 64 layers, this density breakthrough greatly improves storage efficiency, and its built-in DRAM cache allows faster access. Applied with 30µ" gold finger PCB and Corner Bond technology, the MTE662P is fully tested in-house, boasting an endurance rating of 3K Program/Erase cycles and an extended operating temperature ranging from -20°C~75°C. The built-in Power Loss Protection (PLP) further ensures data integrity in mission-critical applications.
Transcend also offers the MTE662P-I with wide temperature (-40℃ ~ 85℃) capabilities to ensure sustained functionality, enhanced endurance, and optimal reliability in mission-critical applications.
Transcend also offers the MTE662P-I with wide temperature (-40℃ ~ 85℃) capabilities to ensure sustained functionality, enhanced endurance, and optimal reliability in mission-critical applications.
- Supports NVM command
- SLC caching technology
- Dynamic thermal throttling
- Built-in LDPC ECC (Error Correction Code) functionality
- Advanced Global Wear-Leveling and Block management for reliability
- Advanced Garbage Collection
- Supports S.M.A.R.T. function to conduct health monitoring, analysis, and reporting for storage devices
- Full drive encryption with Advanced Encryption Standard (AES) (optional)
- Compliant with RoHS 2.0 standards
- Compliant with NVM Express specification 1.3
- Compliant with PCI Express specification 3.1
- Space-saving M.2 form factor (80mm) – ideal for mobile computing devices
- PCIe Gen 3 x4 interface
- DDR4 DRAM Cache embedded
- Endurance: 3K P/E cycles (Program/Erase cycles) guaranteed
- Key components fortified by default with Corner Bond technology
- 30µ" PCB gold finger
- Power Loss Protection (PLP) to prevent data loss in the event of sudden power outage
- Extended Temp. (-20°C ~ 75°C) and Wide Temp. (-40°C ~ 85°C) options available
- Supports Transcend Scope Pro software
Specifications
Features
| Component for | PC/Laptop |
| Data retention | 3 year(s) |
| Drive writes per day (DWPD) | 2 |
| ECC | Yes |
| Interface | PCI Express 3.1 |
| M.2 key ID | M |
| M.2 SSD size | 2280 (22 x 80 mm) |
| Mean time between failures (MTBF) | 3000000 h |
| Memory type | 3D NAND |
| NVMe | Yes |
| NVMe version | 1.3 |
| PCI Express CEM revision | 3.1 |
| PCI Express interface data lanes | x4 |
| Random read (4KB) | 340000 IOPS |
| Random write (4KB) | 355000 IOPS |
| S.M.A.R.T. support | Yes |
| Sequential read speed (CDM) | 3400 MB/s |
| Sequential write speed (CDM) | 2300 MB/s |
| SSD capacity | 256 GB |
| SSD form factor | M.2 |
| TBW rating | 2200 |
Operational conditions
| Operating relative humidity (H-H) | 5 - 95 % |
| Operating shock | 15 G |
| Operating temperature (T-T) | -20 - 75 °C |
| Operating vibration | 20 G |
| Storage temperature (T-T) | -40 - 85 °C |
Other features
| Compliance certificates | BSMI/CE/Federal Communications Commission (FCC)/UKCA |
Power
| Operating voltage | 3.3 V |
| Power consumption (average) | 3.4 W |
| Power consumption (idle) | 0.9 W |
Vendor information
| Brand Name | Transcend |
| Warranty | 1 |
Product Details
2026-04-09
New
Data sheet
- NVMe
- Yes
- ECC
- Yes
- TBW rating
- 2200
- M.2 key ID
- M
- Stromverbrauch (Leerlauf)
- 0.9 W
- Mean time between failures (MTBF)
- 3000000 h
- Compliance certificates
- BSMI/CE/Federal Communications Commission (FCC)/UKCA
- Speichertyp
- 3D NAND
- SSD-Formfaktor
- M.2
- SSD-Kapazität
- 256 GB
- SMART-Unterstützung
- Yes
- Zufälliges Lesen (4KB)
- 340000 IOPS
- Zufälliges Schreiben (4 KB)
- 355000 IOPS
- Betriebsspannung
- 3.3 V
- Betriebsvibration
- 20 G
- Betriebsschock
- 15 G
- NVMe-Version
- 1.3
- Stromverbrauch (Durchschnitt)
- 3.4 W
- Schnittstelle
- PCI Express 3.1
- Brand Name
- Transcend
- Warranty
- 1
- Komponente für
- PC/Laptop
- Betriebstemperatur (TT)
- -20 - 75 °C
- Lagertemperatur (TT)
- -40 - 85 °C
- Relative Luftfeuchtigkeit im Betrieb (HH)
- 5 - 95 %
- Drive writes per day (DWPD)
- 2
- Sequentielle Lesegeschwindigkeit (CDM)
- 3400 MB/s
- Sequentielle Schreibgeschwindigkeit (CDM)
- 2300 MB/s
- M.2 SSD size
- 2280 (22 x 80 mm)
- Datenspuren der PCI-Express-Schnittstelle
- x4
- Vorratsdatenspeicherung
- 3 Jahr(e)
- PCI Express CEM-Revision
- 3.1
Specific References
- MPN
- TS256GMTE662P
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256GB, M.2 2280, 3D NAND, PCIe 3.1 x2, NVMe 1.3, S.M.A.R.T, ECC, 3.3V, 22x80x3.88mm, 9g