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TS256GMTE662P

Name: Transcend TS256GMTE662P
Brand: Transcend
SKU: 2456806
Price: 266.1 CHF
Availability: BackOrder

Brand Transcend

256GB, M.2 2280, 3D NAND, PCIe 3.1 x2, NVMe 1.3, S.M.A.R.T, ECC, 3.3V, 22x80x3.88mm, 9g

CHF266.1

Tax included

CHF246.2 Tax excluded

Delivery in several days

Quantity

Will be ordered for you

Documents et médias

Documents 1

leaflet .pdf

Product Brochure

Télécharger

Description
Product Details

Description

Transcend's MTE662P M.2 SSD features the PCI Express (PCIe) Gen 3 x4 interface and is compatible with NVM Express (NVMe) 1.3 specifications to achieve never-before-seen transfer speeds. The MTE662P features state-of-the-art 3D NAND technology, which allows 96 layers of 3D NAND flash chips to be vertically stacked. Compared to 3D NAND at 64 layers, this density breakthrough greatly improves storage efficiency, and its built-in DRAM cache allows faster access. Applied with 30µ" gold finger PCB and Corner Bond technology, the MTE662P is fully tested in-house, boasting an endurance rating of 3K Program/Erase cycles and an extended operating temperature ranging from -20°C~75°C. The built-in Power Loss Protection (PLP) further ensures data integrity in mission-critical applications.

Transcend also offers the MTE662P-I with wide temperature (-40℃ ~ 85℃) capabilities to ensure sustained functionality, enhanced endurance, and optimal reliability in mission-critical applications.

Supports NVM command
SLC caching technology
Dynamic thermal throttling
Built-in LDPC ECC (Error Correction Code) functionality
Advanced Global Wear-Leveling and Block management for reliability
Advanced Garbage Collection
Supports S.M.A.R.T. function to conduct health monitoring, analysis, and reporting for storage devices
Full drive encryption with Advanced Encryption Standard (AES) (optional)
Compliant with RoHS 2.0 standards
Compliant with NVM Express specification 1.3
Compliant with PCI Express specification 3.1
Space-saving M.2 form factor (80mm) – ideal for mobile computing devices
PCIe Gen 3 x4 interface
DDR4 DRAM Cache embedded
Endurance: 3K P/E cycles (Program/Erase cycles) guaranteed
Key components fortified by default with Corner Bond technology
30µ" PCB gold finger
Power Loss Protection (PLP) to prevent data loss in the event of sudden power outage
Extended Temp. (-20°C ~ 75°C) and Wide Temp. (-40°C ~ 85°C) options available
Supports Transcend Scope Pro software

Specifications

Features

Component for	PC/Laptop
Data retention	3 year(s)
Drive writes per day (DWPD)	2
ECC	Yes
Interface	PCI Express 3.1
M.2 key ID	M
M.2 SSD size	2280 (22 x 80 mm)
Mean time between failures (MTBF)	3000000 h
Memory type	3D NAND
NVMe	Yes
NVMe version	1.3
PCI Express CEM revision	3.1
PCI Express interface data lanes	x4
Random read (4KB)	340000 IOPS
Random write (4KB)	355000 IOPS
S.M.A.R.T. support	Yes
Sequential read speed (CDM)	3400 MB/s
Sequential write speed (CDM)	2300 MB/s
SSD capacity	256 GB
SSD form factor	M.2
TBW rating	2200

Operational conditions

Operating relative humidity (H-H)	5 - 95 %
Operating shock	15 G
Operating temperature (T-T)	-20 - 75 °C
Operating vibration	20 G
Storage temperature (T-T)	-40 - 85 °C

Other features

Compliance certificates

BSMI/CE/Federal Communications Commission (FCC)/UKCA

Power

Operating voltage	3.3 V
Power consumption (average)	3.4 W
Power consumption (idle)	0.9 W

Vendor information

Brand Name	Transcend
Warranty	1

Product Details

Availability date: 2026-05-25

Condition New

Data sheet

NVMe: Yes
ECC: Yes
TBW rating: 2200
M.2 key ID: M
Stromverbrauch (Leerlauf): 0.9 W
Mean time between failures (MTBF): 3000000 h
Compliance certificates: BSMI/CE/Federal Communications Commission (FCC)/UKCA
Speichertyp: 3D NAND
SSD-Formfaktor: M.2
SSD-Kapazität: 256 GB
SMART-Unterstützung: Yes
Zufälliges Lesen (4KB): 340000 IOPS
Zufälliges Schreiben (4 KB): 355000 IOPS
Betriebsspannung: 3.3 V
Betriebsvibration: 20 G
Betriebsschock: 15 G
NVMe-Version: 1.3
Stromverbrauch (Durchschnitt): 3.4 W
Schnittstelle: PCI Express 3.1
Brand Name: Transcend
Warranty: 1
Komponente für: PC/Laptop
Betriebstemperatur (TT): -20 - 75 °C
Lagertemperatur (TT): -40 - 85 °C
Relative Luftfeuchtigkeit im Betrieb (HH): 5 - 95 %
Drive writes per day (DWPD): 2
Sequentielle Lesegeschwindigkeit (CDM): 3400 MB/s
Sequentielle Schreibgeschwindigkeit (CDM): 2300 MB/s
M.2 SSD size: 2280 (22 x 80 mm)
Datenspuren der PCI-Express-Schnittstelle: x4
Vorratsdatenspeicherung: 3 Jahr(e)
PCI Express CEM-Revision: 3.1