6NH261Z60MR-00

AMD EPYC Processors
The New x86 Option
AMD’s return to the CPU segment delivers a whole new value proposition to the x86 world. Built on GIGABYTE’s extensive design expertise across a range of chipset platforms, this AMD EPYC™ platform is already receiving acclaim for its high specification:
- Memory
- I/O
- Network connectivity
This platform is intended as an alternative for builders in the x86 space and packs a real punch in flexibility and expansion options.

Comprehensive I/O
Both single- and dual-socket CPUs come equipped with 128x PCIe lanes, providing extensive I/O options. This is a huge improvement in I/O vs. incumbent x86 offerings.
Increased I/O allows for flexibility in extending your storage, networking or compute to a level previously unattainable with standard server motherboards.
In addition, the integrated nature of the processor – designed as a system-on-chip (SoC) - means that there is no need for a separate PCH and less additional switches needed for expansion lanes.

CMC for Chassis Management & Multi-Node Monitoring
GIGABYTE’s H-Series Servers feature an Aspeed CMC (Central Management Controller) for chassis-level management and node-level monitoring (by connecting internally to Aspeed BMCs integrated on each node). This results only in one MLAN connection required to perform monitoring of all four nodes, resulting in less ToR (Top of Rack) cabling and switch connections.

Multi-Server Management
GIGABYTE’s H-Series Servers also feature the ability to create a “ring” connection for monitoring & management of all servers (incl. chassis-level & node-level) in a rack (including iKVM support) with an onboard LAN hub and dual MLAN ports. Only two ToR (Top of Rack) switch connections are needed to create the ring system, and the ring will not be broken even if one server in the chain is shut down, reducing cabling and switch port usage for greater cost savings and management efficiency.

Dense, High Speed Storage Support
Onboard M.2
GIGABYTE AMD EPYC™ platforms are designed to support on-board ‘M.2’ storage devices for time-sensitive operations and leaves room on the standard storage for compute tasks. Delivering up to 32 Gb/s data transfer speeds, M.2 offers users considerably faster storage performance than current mSATA devices.

Data Security
TPM 2.0 Module
GIGABYTE’s EPYC™ platform is designed to support Trusted Platform Modules (TPM - discrete cryptographic on-board processors).

Carefully Selected Components
GIGABYTE’s passive components are carefully selected to guarantee a stable operating environment and allow the processors and the memory to deliver their maximum performance. GIGABYTE’s server motherboards are built with long lasting components for a high degree of reliability and durability.

Ease of Deployment and Management
GIGABYTE continues to be responsive to market needs and to create user-friendly solutions, including:
- Tool-less rail kit included as a default across all new server models
- Supplying multiple connector options and tools where appropriate

Efficient, Reliable Power Supply
GIGABYTE SERVER AMD EPYC servers are designed to guarantee high conversion efficiency regardless of load. Redundant 80 Plus ‘Titanium’ or ‘Platinum’ PSUs, combined with GIGABYTE’s precision engineering, translates to super efficient power usage which maximizes the system’s power : performance ratio and reduces OPEX for the user.

Intelligent Power Management Features
Cold Redundancy
To take advantage of the fact that a PSU will run at greater power efficiency with a higher loading, GIGABYTE has introduced a power management feature called Cold Redundancy for servers with dual PSU. When the total system loading falls lower than 40%, the system will automatically place one PSU into standby mode, enabling the other PSU to take over the greater load. This can enable total system power efficiency savings of up to 10%.

SCMP (Smart Crises Management / Protection)
SCMP is a GIGABYTE patented feature that will automatically force the system’s CPU to enter ULFM (ultra-low frequency mode for minimum power consumption) when the BMC is alerted to a PSU fault or error (such as power loss, power surge, overheating or a fan problem). This feature will prevent shutdown in systems with less than 1 + 1 PSU redundancy when one PSU is lost. In a 2U 4 Node server, only two nodes will be switched to low power mode, while two remaining nodes can continue normal operation. When the fault is resolved or the PSU is replaced, the system will automatically return to normal power mode.

GIGABYTE H261-Z60. Processor socket: Socket SP3. Supported memory types: DDR4-SDRAM, Supported RDIMM clock speeds: 2133,2400,2666 MHz, Memory channels: Octa-channel. Storage drive sizes supported: 2.5". On-board graphics card model: Aspeed AST2500. Ethernet interface type: Gigabit Ethernet, Ethernet LAN data rates: 10,100,1000 Mbit/s, LAN controller: Intel® I350-AM2

Built-in processor	No
Processor socket	Socket SP3
Number of processors supported	8
Number of DIMM slots	16
Supported memory types	DDR4-SDRAM
Supported RDIMM clock speeds	2133,2400,2666 MHz
Memory channels	Octa-channel
Hot-swap HDD bays	Yes
Number of 2.5" bays	24
Storage drive sizes supported	2.5"
On-board graphics card model	Aspeed AST2500
Ethernet LAN	Yes
Ethernet interface type	Gigabit Ethernet
Ethernet LAN data rates	10,100,1000 Mbit/s
LAN controller	Intel® I350-AM2
USB 2.0 ports quantity	0
Ethernet LAN (RJ-45) ports	4
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity	8
VGA (D-Sub) ports quantity	4
COM ports quantity	1
Number of M.2 (M) slots	8
Trusted Platform Module (TPM)	Yes
Backplanes support	Yes
Harmonized System (HS) code	84714100
Chassis type	Rack (2U)
Product color	Black
LED indicators	Yes
On/off switch	Yes
Reset button	Yes
Number of fans	8 fan(s)
Fan diameter	3.15" (8 cm)
Power supply	2200 W
Redundant power supply (RPS) support	Yes
Number of redundant power supplies installed	2
80 PLUS certification	80 PLUS Platinum
Operating temperature (T-T)	10 - 35 °C
Storage temperature (T-T)	-40 - 60 °C
Operating relative humidity (H-H)	8 - 80%
Storage relative humidity (H-H)	20 - 95%
Width	17.3" (440 mm)
Depth	32.3" (820 mm)
Height	3.43" (87 mm)
Package width	45.9" (1167 mm)
Package depth	12.2" (309 mm)
Package height	27.6" (700 mm)