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Boost your PC’s performance to new levels.
You need the right expert for the right PC memory solution.
Samsung is a leader in the DRAM market, with our DRAM being selected by most OEMs for many years.
Embrace the cutting-edge Samsung DDR4 to take your PC to a new dimension of high speed and low energy performance.

Improved bandwidth for high-end applications.
With PC applications becoming more critical and complex, personal computing has set its toughest demands yet. PCs today need to provide exceptional speed to deliver the performance required.

Samsung 2xnm DDR4 UDIMM and SODIMM enable initial bandwidth of 2,400 Mbps, which can achieve up to the JEDEC-defined 3,200 Mbps. DDR4 has 2 times higher bandwidth than DDR3.

Complete multi-tasking with less energy.
Consumers want to be able to rely on excellent battery power to complete their tasks. Samsung PC DRAM provides longer time unplugged through lower power consumption. This enables extended battery life for notebooks while maintaining high performance.

Samsung DDR4 SODIMM and UDIMM consume less power with their unique 2xnm technology. Samsung’s 2xnm DDR4 operating at 1.2V achieves approximately 26% higher performance/watt compared to 2xnm DDR3 operating at 1.5V.

Samsung also provides 2xnm LPDDR4 operating at 1.1V, achieving 37% increase in power efficiency than 2xnm LPDDR3 operating at 1.2V.

Double your capacity with the world’s 1st 8Gb chips.
The advancement in density has enabled Samsung to offer bigger capacity DRAM, delivering the faster data transmission speed that devices require today. PCs can benefit from high density DRAM by using fewer DRAM components, which leads to space saving.

Samsung DDR4 UDIMM can achieve the max capacity of 128GB using the world’s 1st 8Gb chips, which is 2 times bigger than that of DDR3’s 64GB made of 4Gb chips.

Samsung 16GB DDR3 1600MHz. Component for: PC/server, Internal memory: 16 GB, Memory layout (modules x size): 1 x 16 GB, Internal memory type: DDR3, Memory clock speed: 1600 MHz, Memory form factor: 240-pin DIMM, CAS latency: 11, ECC

Internal memory	16 GB
Memory layout (modules x size)	1 x 16 GB
Internal memory type	DDR3
Memory clock speed	1600 MHz
Component for	PC/server
Memory form factor	240-pin DIMM
ECC	Yes
Buffered memory type	Registered (buffered)
CAS latency	11
Memory voltage	1.35 V
Module configuration	2048M x 72
Row cycle time	11 ns
Refresh row cycle time	11 ns
Operating temperature (T-T)	0 - 85 °C
Compliance certificates	RoHS
Width	5.25" (133.3 mm)
Depth	0.157" (4 mm)
Height	1.18" (30 mm)
Harmonized System (HS) code	84733020